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BM6201FS ? product structure : silicon hybrid integrated circuit ? this product is not designed prot ection against radioactive rays . 1/19 tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 tsz22111 14 001 http://www.rohm.com for air-conditioner fan motor 600v prestomos? built-in three phase brushless fan motor driver BM6201FS ? general description this motor driver ic adopts prestomos? as the output transistor, and put in a small full molding package with the high voltage gate driver chip. the protection circuits ~ overcurrent, overheating, under voltage lock out ~ and the high voltage bootstrap diode with current regulation are built into, and provides optimum motor drive system for a wide variety of applications by the combination with controller bd6201x series, and enables motor unit standardization. ? features ?? 600v prestomos? built-in ?? output current 1.5a ?? bootstrap operation by fl oating high side driver (including diode) ?? 3.3v logic input compatible ?? protection circuits provided: ocp, tsd and uvlo ?? fault output (open drain) ? applications ?? air conditioners; air cleaners; water pumps; dishwashers; washing machines ?? general oa equipment ? key specifications ?? output mosfet voltage: 600v ?? driver output current (dc): 1.5a(max.) ?? driver output current (pulse): 2.5a(max.) ?? output mosfet dc on resistance: 2.7 ? (typ.) ?? operating case temperat ure: -20c to +100c ?? power dissipation: 3.0w ? package w(typ.) x d(typ.) x h(max.) ssop-a54_42 22.0mm x 14.1mm x 2.4mm ? typical application circuit fig.1 application circuit example - BM6201FS & bd6201x r8 r9 vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc bd6201x BM6201FS r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14 vreg ssop-a54_42
2/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? block diagram and pin configuration fig.2 block diagram fig.3 pin configuration ? pin descriptions (nc: no connection) pin name function pin name function 1 vcc low voltage power supply 42 vdc high voltage power supply 2 nc 41 vdc high voltage power supply 3 fob fault signal output (open drain) 4 nc 40 bu phase u floating power supply 5 uh phase u high side control input 39 u phase u output 6 ul phase u low side control input 38 u phase u output 7 nc : : 37 bv phase v floating power supply 11 nc 36 v phase v output 12 vh phase v high side cont rol input 35 v phase v output 13 vl phase v low side control input 14 nc : : 34 vdc high voltage power supply 19 nc 33 vdc high voltage power supply 20 wh phase w high side control input 21 wl phase w low side control input 22 nc 32 bw phase w floating power supply 23 fob fault signal output (open drain) 31 w phase w output 24 nc 30 w phase w output 25 vcc low voltage power supply 26 nc 29 pgnd ground (current sense pin) 27 gnd ground 28 pgnd ground (c urrent sense pin) level shift & gate driver bu u m 40 39 1 vcc gnd vdc 5 uh 6 ul bv v 37 36 12 vh 13 vl bw w pgnd 32 31 20 wh 21 wl 29 3 fob 23 fob 25 vcc vdc pgnd 28 27 30 w 35 38 u v fault sdb level shift & gate driver fault sdb level shift & gate driver fault sdb trip 34 33 vdc vdc vcc 41 42 fault trip trip vcc fob uh ul vh vl wh wl fob vcc gnd pgnd pgnd w w bw vdc vdc v v bv u u bu vdc vdc
3/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? functional descriptions 1) control input pins (uh, ul, vh, vl, wh, wl) the input threshold voltage of the control pins are 2.5v and 0.8v, with a hysteresis voltage of approximately 0.4v. the ic will acce pt input voltages up to the vcc voltage. when the same phase control pins are input hi gh at the same time, the high side and low side gate driver outputs low. however, it wishes measures as the dead time is installed in the control signals. the contro l input pins are connected internally to pull-down resistors (100k ? nominal). however, when the switching no ise on the output stage may affect the input on these pins and cause undesired operation. in such cases, attaching an external pull-down resistor (10k ? recommended) between each control pin and ground, or connecting each pin to an input voltage of 0.8v or less (preferably gnd), is recommended. 2) under voltage lock out (uvlo) circuit to secure the lowest power supply voltage necessary to o perate the driver, and to preven t under voltage malfunctions, the uvlo circuits are independently built into the upper side floating driver and the lower side driver. when the supply voltage falls to v uvl or below, the controller forces driver outputs low. when the voltage rises to v uvh or above, the uvlo circuit ends the lockout operation and returns the chip to nor mal operation. even if the controller returns to normal operation, the output begins from t he following control input signal. fig.4 low voltage monitor - uvlo - timing chart truth table hin lin ho lo l l l l h l h l l h l h h h inhibition vcc hin lin ho lo vb hin lin ho lo v ccuvh v ccuvl v buvh v buvl
4/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 3) bootstrap operation fig.5 charging period fig.6 discharging period the bootstrap is operated by the charge period and the di scharge period being alternately repeated for bootstrap capacitor (cb) as shown in the above figure. in a word, th is operation is repeated while the output of an external transistor is switching with synchronous re ctification. because the suppl y voltage of the floating driver is charged from the vcc power supply to cb through prevention of ba ckflow diode dx, it is approximately (vcc-1v). the resistance series connection with dx has the impedance of approximate 200 ? . the capacitance value for the bootstrap is following: example) floating driver power supply quiescence current i bbq : 150a(max.) bootstrap diode reverse bias current i lbd : 10a(max.) carrier frequency f pwm : 20khz output mosfet total gate charge qg : 25nc(max.) floating driver transmission loss q loss : 1nc(max.) drop voltage of the floati ng driver power supply dv drop : 3v c boot ? (( i bbq + i lbd ) / f pwm + 2 x qg + q loss ) / dv drop 20nf the drop voltage can be allowed actually becomes small further by the range of the use power supply voltage, the output mosfet on resistance, the forward voltages of the internal bo ot diode (the drop voltage to the capacitor by the charge current), and the power supply voltage monitor circuits etc. please set the tenfold or more the calculation value to the criterion about the capacitance value to secure the margin in consideration of temperatur e characteristics and the value change, etc. moreover, the example of the mentioned above assumes the synchron ous rectification switching. because the total gate charge is needed only by the carrier frequency in the upper sw itching section, for example 150 commutation driving, it becomes a great capacity shortage in the above settings. please set it after often confirming actual application operation. 4) thermal shutdown (tsd) circuit the tsd circuit operates when the junction temperature of the gate driver exceeds t he preset temperature (150c nominal). at this time, the controller forces all driver outputs low. since thermal hysteresis is provided in the tsd circuit, the chip returns to normal operation when the junction temper ature falls below the preset temperature (125c nominal). the tsd circuit is designed only to shut the ic off to prev ent thermal runaway. it is not designed to protect the ic or guarantee its operation in the pres ence of extreme heat. do not continue to use the ic after the tsd circuit is activated, and do not use the ic in an environment where activation of the circuit is assumed. moreover, it is not possible to follow to the output mosfet junction temperature rising rapidly because it is a gate driver chip that monitors the temperature and it is likely not to function effectively. 5) overcurrent protection (ocp) circuit the overcurrent protection circuit can be activated by connec ting a low value resistor for current detection between the pgnd pin and the gnd pin. when the pgnd pin voltage reaches or surpasses the threshold value (0.9v nominal), the gate driver outputs low to t he gate of all output mosfets, thus initiating the over current protection operation. c b ho vs vdc vb l h dx lo off on vcc c b ho vs vdc vb h l dx lo on off vcc
5/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 fob vreg fib bd6201xfs BM6201FS 100k c 6) fault signal output when the gate driver detects the either state that should be protected, voltage monitor (uvlo), overheating (tsd) or overcurrent (ocp), the fob pin outputs lo w (open drain). when these are detected with either of the gate driver chip because the fob pin is wired-or connection with each phase ga te driver chip internally, another phase also entering the protection operation. even when this function is not used, the fob pin is pull-up to the volt age of 3v or more and at least the resistor 10k ? or more. moreover, the signal from the outside of t he chip is not passed built-in analog filter, but the internal control signals (uvlo / tsd / ocp) passes the filter (2.0s min.) for the malfuncti on prevention by the switching noise etc. fig.7 fault signal bi-directional input pin interface the release time of return from the pr otection operation can be change to insert the external capacitor. refer to the formula to the below. 2ms or more is recommended. fig.8 release time setting application circuit fig.9 release time (reference data @r=100k ? ) when using controller bd6201x series as a control ic, since the external fault signal input pin of the side of the control ic has the internal pull-up resistor, it can be di rectly linked with fob pin. refer to figure 10. fig.10 interface equivalent circuit 2.0 t = - ln ( 1 - vpu ) r c [s] fob shutdown tsd ocp uvlo filter fault fob vpu r c 0 1 2 3 4 5 6 7 8 9 10 0.01 0.1 1 capacitance: c [f] release time: t [ms] _ vpu = 15v vpu = 5v
6/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 7) switching time fig.11 switching time definition parameter symbol reference unit conditions t dh(on) 820 ns t rh 110 ns t rrh 200 ns t dh(off) 590 ns high side switching time t fh 20 ns t dl(on) 880 ns t rl 120 ns t rrl 180 ns t dl(off) 670 ns low side switching time t fl 50 ns vdc=300v, vcc=15v, i d =0.75a vin= 0v ? 5v, inductive load xh, xl v ds i d t on t d(on) t r t rr t d(off) t off t f 10% 90% 10% 90%
7/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? absolute maximum ratings (ta=25c) ratings parameter symbol BM6201FS unit output mosfet v dss 600* 1 v supply voltage v dc -0.3 to 600* 1 v output voltage v u , v v , v w -0.3 to 600* 1 v high side supply pin voltage v bu , v bv , v bw -0.3 to 600* 1 v high side floating supply voltage v bu -v u , v bv -v v , v bw -v w -0.3 to 20 v low side supply voltage v cc -0.3 to 20 v all others v i/o -0.3 to v cc v driver outputs (dc) i omax(dc) 1.5* 2 a driver outputs (pulse) i omax(pls) 2.5* 2 a fault signal output i omax(fob) 5* 1 ma power dissipation pd 3.00* 3 w thermal resistance r thj-c 15 c/w operating case temperature t c -20 to 100 c storage temperature t stg -55 to 150 c junction temperature t jmax 150 c *1 do not, however, exceed pd or aso. *2 pw 10s, duty cycle 1% *3 mounted on a 70mm x 70mm x 1.6mm fr4 glass-epoxy board wi th less than 3% copper foil. de rated at 24mw/c above 25c. ? operating conditions (tc=25c) range parameter symbol min. typ. max. unit supply voltage v dc - 310 400 v high side floating supply voltage v bu -v u , v bv -v v , v bw -v w 13.5 15 16.5 v low side supply voltage v cc 13.5 15 16.5 v minimum input pulse width t min 0.8 - - s dead time t dt 1.5 - - s shunt resistor (pgnd) r s 0.4 - - ? junction temperature t j - - 125 c
8/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? electrical characteristics (unless otherwise specified, ta=25c and vcc=15v) limits parameter symbol min. typ. max. unit conditions power supply hs quiescence current i bbq 30 70 150 a xh=xl=l, each phase ls quiescence current i ccq 0.4 0.9 1.5 ma xh=xl=l output mosfet d-s breakdown voltage v (br)dss 600 - - v i d =1ma, xh=xl=l leak current i dss - - 100 a v ds =600v, xh=xl=l dc on resistance r ds(on) - 2.7 3.5 ? i d =0.75a diode forward voltage v sd - 1.1 1.5 v i d =0.75a bootstrap diode leak current i lbd - - 10 a v bx =600v forward voltage v fbd 1.5 1.8 2.1 v i bd =-5ma, including series-r series resistance r bd - 200 - ? control inputs input bias current i xin 30 50 70 a v in =5v input high voltage v xinh 2.5 - vcc v input low voltage v xinl 0 - 0.8 v uvlo hs release voltage v buvh 9.5 10.0 10.5 v v bx - v x hs lockout voltage v buvl 8.5 9.0 9.5 v v bx - v x ls release voltage v ccuvh 11.0 11.5 12.0 v ls lockout voltage v ccuvl 10.0 10.5 11.0 v overcurrent protection threshold voltage v sns 0.8 0.9 1.0 v fault output output low voltage v fol - - 0.8 v i o =+10ma input high voltage v finh 2.5 - vcc v input low voltage v finl 0 - 0.8 v noise masking time t mask 2.0 - - s
9/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) 20 40 60 80 100 120 12 14 16 18 20 supply voltage : v bx -v x [v] supply current : i qvbx [a] _ 125c 25c -25c 1.0 1.5 2.0 2.5 3.0 12 14 16 18 20 supply voltage : vcc [v] supply current : icc [ma] 125c 25c -25c 0.0 0.5 1.0 1.5 2.0 12 14 16 18 20 supply voltage : vcc [v] supply current : icc [ma] 125c 25c -25c fig.14 low side drivers operating current fig.15 quiescence current (f pwm :20khz, two phase switching) (high side driver, each phase) fig.12 quiscence current fig.13 low side drivers operating current (low side drivers) (f pwm :20khz, one phase switching) 0.0 0.5 1.0 1.5 2.0 12 14 16 18 20 supply voltage : vcc [v] supply current : icc [ma] 125c 25c -25c
10/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued 0 5 10 15 20 1.0 1.5 2.0 2.5 input voltage : v in [v] internal logical voltage : v out [v] 125c 25c -25c fig.18 input threshold voltage fig.19 overcurrent detection voltage (uh,ul,vh,vl,wh,wl,fob) fig.16 high side driver operating current fig.17 input bias current (f pwm :20khz, each phase) (uh,ul,vh,vl,wh,wl) 100 150 200 250 300 12 14 16 18 20 supply voltage : v bx -v x [v] supply current : i qvbx [a] _ 125c 25c -25c 0 50 100 150 200 250 0 5 10 15 20 input voltage : v hin /v lin [v] input current : i hin /i lin [a] _ 125c 25c -25c 0 5 10 15 20 0.6 0.7 0.8 0.9 1.0 1.1 1.2 input voltage : v pgnd [v] internal logical voltage : v out [v] 125c 25c -25c
11/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.22 external fault input propagatio n delay fig.23 fault output on resistance (fob) fig.20 thermal shut down fig.21 noise masking time 0 5 10 15 20 100 110 120 130 140 150 160 170 180 junction temperature : tj [c] internal logical voltage : v out [v] 0 2 4 6 8 -25 0 25 50 75 100 125 junction temperature : tj [c] noise masking time : t mask [s] tsd uvlo ocp 0 50 100 150 200 -25 0 25 50 75 100 125 junction temperature : tj [c] propagation delay time : t dfob [ns] on off 0.0 0.2 0.4 0.6 0.8 1.0 0246810 output current : i fob [ma] output voltage : v fob [v] 125c 25c -25c
12/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.26 minimum input pulse width fi g.27 input/output propagation delay fig.24 under voltage lock out fig.25 under voltage lock out (high side driver, each phase) (low side drivers) 0 5 10 15 20 8 9 10 11 12 13 supply voltage : vcc [v] internal logical output voltage : v out [v] 125c 25c -25c 125c 25c -25c 0 500 1000 1500 12 13 14 15 16 17 18 supply voltage : vcc [v] input/output propagation delay : td [ns] solid : td (on) dashed : td (off) 0 500 1000 1500 12 13 14 15 16 17 18 supply voltage : vcc [v] minimum input pulse width : t pwmin [ns] solid : low side dashed : high side 0 5 10 15 20 8 9 10 11 12 13 supply voltage : v bx - v x [v] internal logical voltage : v out [v] 125c 25c -25c 125c 25c -25c
13/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.30 bootstrap diode forward voltage fig.31 bootstrap series resistor fig.28 output mosfet on resistance fig.29 output mosfet body diode 0 2 4 6 8 0.0 0.5 1.0 1.5 2.0 drain current : i ds [a] output on resistance : r dson [ohm] 125c 25c -25c 0.0 0.5 1.0 1.5 2.0 0.0 0.5 1.0 1.5 2.0 source current : i sd [a] forward voltage : v sd [v] -25c 25c 125c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0246810 bootstrap diode current : i bd [ma] forward voltage : v fbd [v] -25c 25c 125c 0 1 2 3 4 0246810 bootstrap series resistor current : i br [ma] voltage : v bootr [v] 125c 25c -25c
14/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? typical performance curves (reference data) - continued fig.34 low side switching loss fig.35 low side recovery loss (vdc=300v) (vdc=300v) fig.32 high side switching loss fig.33 high side recovery loss (vdc=300v) (vdc=300v) 0 50 100 150 200 0.0 0.5 1.0 1.5 drain current : i o [a] e [j] 125c 25c -25c eon eoff 0 5 10 15 0.0 0.5 1.0 1.5 drain current : i o [a] e [j] -25c 25c 125c 0 50 100 150 200 0.0 0.5 1.0 1.5 drain current : i o [a] e [j] 125c 25c -25c eon eoff 0 5 10 15 0.0 0.5 1.0 1.5 drain current : i o [a] e [j] -25c 25c 125c
15/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? application circuit example fig.36 application circuit example (150 commutation driver) parts list parts value manufacturer type parts value ratings type ic1 - rohm BM6201FS c1 0.1f 50v ceramic ic2 - rohm bd62012fs c2~4 2200pf 50v ceramic r1 1k ? rohm mcr18ezpf1001 c5 10 ? f 50v ceramic r2 150 ? rohm mcr18ezpj151 c6 10 ? f 50v ceramic r3 22k ? rohm mcr18ezpf2202 c7~9 1f 50v ceramic r4 100k ? rohm mcr18ezpf1003 c10 0.1f 50v ceramic r5 100k ? rohm mcr18ezpf1003 c11 1f 50v ceramic r6 0.5 ? rohm mcr50jzhfl1r50 x 3 c12 100pf 50v ceramic r7 10k ? rohm mcr18ezpf1002 c13 0.1f 630v ceramic r8 0 ? rohm mcr18ezpj000 c14 0.1f 50v ceramic r9 0 ? rohm mcr18ezpj000 hx - - hall elements q1 - rohm dtc124eua d1 - rohm kdz20b r8 r9 vreg c5 hu hv hw vsp fg dtr vcc gnd m vdc ic2 ic1 r1 r2 r3 r4 r5 r6 r7 q1 c1 c2~c4 c6 c7 c8 c9 c10 c11 c12 c13 d1 c14 vreg
16/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? interfaces fig.37 uh, ul, vh, vl, wh, wl fig.38 pgnd fig.39 fob fig.40 vcc, gnd, vdc, bx(bu/bv/bw), x(u/v/w) vreg 100k vh vl uh ul wh wl pgnd vreg fob vcc gnd x bx pgnd vdc
17/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? notes for use 1) absolute maximum ratings devices may be destroyed when supply voltage or operating te mperature exceeds the absolute maximum rating. because the cause of this damage cannot be identified as, for example, a short circuit or an op en circuit, it is important to consider circuit protection measures ? such as adding fuses ? if an y value in excess of absolute maximum ratings is to be implemented. 2) electrical potential at gnd keep the gnd terminal potential to the minimum potential unde r any operating condition. in addition, check to determine whether there is any terminal that pr ovides voltage below gnd, including the voltage during transient phenomena. however, note that even if the voltage does not fall below g nd in any other operating condit ion, it can still swing below gnd potential when the motor generates back el ectromotive force at the pgnd pin. t he chip layout in this product is designed to avoid this sort of electrical potential problem, but pulling excessive current may still result in malfunctions. therefore, it is necessary to observe operat ion closely to conclusively confirm that there is no problem in actual operation. if there are a small signal gnd and a high current gnd, it is recommended to sepa rate the patterns for the high current gnd and the small signal gnd and provide a pr oper grounding to the reference point of the set not to affect the voltage at the small signal gnd with the change in voltage due to resist ance component of pattern wiring and high current. also for gnd wiring pattern of the component exte rnally connected, pay special attenti on not to cause undesirable change to it. 3) high voltage terminal ? vdc, bu/u, bv/v and bw/w when using this ic, the high voltage terminals - vdc, bu/u, bv/v and bw/w - need a resin coating between these pins, it is judged the inter-pins distance not enough. if any specia l mode in excess of absolute maximum ratings is to be implemented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage clamping diodes or fuses. and, set t he output transistor so that it does not exceed absolute maximum ratings or aso. in the event a large capacitor is connected between the output and ground, if vcc and vdc are short-circuited with 0v or ground for any reason, the current charged in the ca pacitor flows into the outp ut and may destroy the ic. 4) power supply lines return current generated by the motor?s back-emf requires coun termeasures, such as providing a return current path by inserting capacitors across the power supply and gnd (10f, ce ramic capacitor is recommended ). in this case, it is important to conclusively confirm that none of the negative effe cts sometimes seen with electrol ytic capacitors ? including a capacitance drop at low temperatures - occurs. also, the conn ected power supply must have sufficient current absorbing capability. otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause problems with the product, including peripheral circuits exc eeding the absolute maximum rating. to help protect against damage or degradation, physical safety measures should be ta ken, such as providing a voltage clamping diode across the power supply and gnd. 5) thermal design use a thermal design that allows for a sufficient margin in lig ht of the power dissipation (pd) in actual operating conditions. 6) inter-pin shorts and mounting errors use caution when positioning the ic for mounting on print ed circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. also, connecti ng the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the po wer supply lines, such as establishing an external diode between the power supply and t he ic power supply pin. 7) operation in strong electromagnetic fields using this product in strong electromagnet ic fields may cause ic malfunctions. us e extreme caution with electromagnetic fields. 8) testing on application boards when testing the ic on an application board, connecting a capacitor to a low impedance pin subjects the ic to stress. always discharge capacitors after each process or step. always turn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection pr ocess. ground the ic during assembly steps as an antistatic measure. use similar precaution w hen transporting or storing the ic. 9) regarding the input pin of the ic do not force the voltage to the input pins when the power does not supply to the ic. also, do not force the voltage to the input pins exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the ic. status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help read ing the formal version. if there are any differences in translation version of this document formal version takes priority.
18/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? ordering information ? physical dimension, tape and reel information ? marking diagram b m 6 2 0 1 f s - e 2 rohm part number bm6201 : 600v/1.5a bm6202 : 600v/2.5a package fs : ssop-a54_42 packaging specification e2 : embossed taping ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 1000pcs e2 () direction of feed reel 1pin ssop-a54_42 1pin mark lot no. product name ssop-a54_42 (top view) BM6201FS
19/19 datasheet d a t a s h e e t BM6201FS tsz02201-0828ab400010-1-2 ? 2012 rohm co., ltd. all rights reserved. 26.mar.2012 rev.001 http://www.rohm.com tsz22111 15 001 ? revision history date revision changes 26.mar.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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